Japan Intellectual Property Rights: MANUFACTURING METHOD FOR SEMICONDUCTOR EPITAXIAL WAFER

Japan, Jan. 20 -- SUMCO CORP has got intellectual property rights for 'MANUFACTURING METHOD FOR SEMICONDUCTOR EPITAXIAL WAFER.' Other related details are as follows:

Application Number: JP,2022-200565

Category (FI): H01L21/205,H10P14/20,H01L21/20,H01L21/265@Q,H10P30/20@Z,H10P30/20@Q,H10P36/00@J,C30B25/20,H10P14/24,C30B29/06,504@A,H01L21/322@J,H01L21/265@Z

Stage: Grant (IP right document published.)

Filing Date: Dec. 15, 2022

Publication Date: June 27, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.