Japan, March 5 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'MANUFACTURING METHOD OF DEVICE CHIP.' Other related details are as follows:
Application Number: JP,2021-194641
Category (FI): H01L21/302,102,H10P58/00@W,H10P58/00@S,H10P58/00@L,H10P58/00@B,H10P50/20,400,H10P50/20,102,H10P50/20,101@B,B23K26/364,H01L21/302,101@B,H01L21/461,H01L21/78@W,H01L21/78@S,H01L21/78@B,H01L21/78@L
Stage: PROBLEM TO BE SOLVED: To provide a manufacturing method of a device chip, capable of suppressing hardening of a resin layer as compared with a conventional one.SOLUTION: A manufacturing method of manufacturing a device chip containing a device by dividing a plate-like processed material provided with the device by a division scheduled line, in a region on a front surface side divided by the division schedule line, contains: a resin layer formation step of forming a resin layer containing an uncured or semi-cured resin on the front surface of the processed material; and a processed material cutting step of manufacturing the device chip by cutting the processed material along the division schedule line from a back surface side of the processed material on which the resin layer is provided onto the front surface side after the resin layer formation step.SELECTED DRAWING: Figure 5 (Grant)
Filing Date: Nov. 30, 2021
Publication Date: June 9, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
