Japan Intellectual Property Rights: MANUFACTURING METHOD OF LAMINATED ELECTRONIC COMPONENT

Japan, Nov. 11 -- MURATA MFG CO LTD has got intellectual property rights for 'MANUFACTURING METHOD OF LAMINATED ELECTRONIC COMPONENT.' Other related details are as follows:

Application Number: JP,2022-207322

Category (FI): H01G4/30,311@F,H01G4/30,517,H01G4/30,311@Z,H01G4/30,311@D,H01G4/30,311@A,H01G13/00,361@Z

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Dec. 23, 2022

Publication Date: July 4, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.