Japan, March 5 -- ABSOLICS INC has got intellectual property rights for 'MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE USING THE SAME.' Other related details are as follows:
Application Number: JP,2024-145545
Category (FI): H10W70/68,200,H10W70/692,H10W70/695,H10W70/00@F,H05K3/46@T,H05K3/46@Q,H01L23/14@R,H01L23/14@C,H01L23/12@F
Stage: PROBLEM TO BE SOLVED: To provide a packaging substrate which prevents an undulation phenomenon due to a gap between elements and/or a gap between a cavity portion and an element, and a manufacturing method thereof.SOLUTION: A packaging substrate includes a core layer 22 including a glass substrate 21 having a first surface and a second surface facing each other and a cavity portion passing through the glass substrate, wherein a cavity module is disposed in the cavity portion, the cavity module comprises a cavity element 40 and a first insulating layer 61 enclosing the cavity element. The first insulation layer is formed on some surfaces other than one surface or on all the surface of the cavity element, and a second insulating layer 62 is further incorporated into the remaining portion of the cavity portion other than the cavity module, and the first insulating layer and the second insulating layer have different dielectric constants.SELECTED DRAWING: Figure 6 (Grant)
Filing Date: Aug. 27, 2024
Publication Date: March 14, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
