Japan, Jan. 21 -- SEIKO EPSON CORP has got intellectual property rights for 'MANUFACTURING METHOD OF THREE-DIMENSIONAL MOLDED ARTICLE, AND THREE-DIMENSIONAL MOLDING DEVICE.' Other related details are as follows:
Application Number: JP,2020-033137
Category (FI): B33Y10/00,B33Y30/00,B29C64/118
Stage: Grant (IP right document published.)
Filing Date: Feb. 28, 2020
Publication Date: Sept. 13, 2021
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
