Japan, Jan. 21 -- SUMCO CORP has got intellectual property rights for 'MEASURING DEVICE FOR THICKNESS OF WORK-PIECE, MEASURING METHOD FOR THICKNESS OF WORK-PIECE, AND POLISHING SYSTEM FOR WORK-PIECE.' Other related details are as follows:
Application Number: JP,2022-136161
Category (FI): G01B11/06@G,G01B9/02055,G01B11/02@G
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 29, 2022
Publication Date: March 12, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
