Japan, Feb. 18 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'MEMBER FOR SOLDER BUMP FORMATION.' Other related details are as follows:
Application Number: JP,2022-053630
Category (FI): H01L21/92,604@H,H05K3/34,505@A,H05K3/3478,H05K3/3485,H10W72/20,103@C
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 29, 2022
Publication Date: Oct. 12, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
