Japan, June 10 -- YAZAKI CORP has got intellectual property rights for 'METHOD FOR BONDING METAL PLATE AND METAL SHEET, METHOD FOR MANUFACTURING BUS BAR MODULE, AND METHOD FOR MANUFACTURING BATTERY MODULE.' Other related details are as follows:
Application Number: JP,2022-115014
Category (FI): H01M50/519,B23K26/21@G,H01M50/507,H01M50/522,H01M50/505,B23K26/21@N,H01R43/02@B,H01R4/02@C
Stage: Grant (IP right document published.)
Filing Date: July 19, 2022
Publication Date: Jan. 31, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
