Japan, June 10 -- HANMISEMICONDUCTOR CO LTD has got intellectual property rights for 'METHOD FOR CUTTING SEMICONDUCTOR MATERIAL.' Other related details are as follows:
Application Number: JP,2022-093331
Category (FI): B24B49/14,H10P58/00@C,H10P58/00@F,B24B55/06,B24B49/12,B24B27/06@M,H01L21/78@F,H01L21/78@C,B24B55/02@D
Stage: Grant (IP right document published.)
Filing Date: June 8, 2022
Publication Date: Jan. 25, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
