Japan Intellectual Property Rights: METHOD FOR GRINDING WORKPIECE AND METHOD FOR MANUFACTURING DEVICE CHIP

Japan, Oct. 21 -- DISCO CORP has got intellectual property rights for 'METHOD FOR GRINDING WORKPIECE AND METHOD FOR MANUFACTURING DEVICE CHIP.' Other related details are as follows:

Application Number: JP,2022-089375

Category (FI): H10P58/00@Y,H01L21/78@Q,H01L21/78@M,H01L21/78@X,H01L21/78@Y,H01L21/304,631,H10P52/00@C,H10P52/00@T,H10P58/00@M,H10P58/00@Q,H10P58/00@X

Stage: Grant (IP right granted following substantive examination.)

Filing Date: June 1, 2022

Publication Date: Dec. 13, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.