Japan, June 10 -- TOSHIBA CORP,TOSHIBA MATERIALS CO LTD has got intellectual property rights for 'METHOD FOR MANUFACTURING CERAMIC THIN FILM METALIZATION SUBSTRATE, METHOD FOR MANUFACTURING CHIP-ON-SUBMOUNT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE.' Other related details are as follows:
Application Number: JP,2025-041983
Category (FI): H05K3/02@A,H01L23/12@D,G03F7/40,521,H10H20/857,G03F7/42,G03F7/38,H10W70/05,200
Stage: Grant (IP right document published.)
Filing Date: March 17, 2025
Publication Date: July 28, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
