Japan, Aug. 26 -- SAMSUNG ELECTRO-MECHANICS CO LTD has got intellectual property rights for 'METHOD FOR MANUFACTURING CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR.' Other related details are as follows:
Application Number: JP,2022-000090
Category (FI): H01G4/30,311@D,H01G4/30,516,B22F1/107,B22F1/00@M,B22F1/00@L,B22F9/00@B,H01G4/30,517,H01B13/00@Z,B22F1/00@K,H01G4/30,201@D
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 4, 2022
Publication Date: April 5, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
