Japan, July 20 -- IWATE UNIV has got intellectual property rights for 'METHOD FOR MANUFACTURING LAMINATE, LAMINATE, PRINTED CIRCUIT, DEVICE CIRCUIT, AND ELECTRIC AND ELECTRONIC DEVICE.' Other related details are as follows:
Application Number: JP,2023-050422
Category (FI): H05K3/18@H,H05K3/18@J,H05K3/38@A,C08J7/12@A,B32B15/082@B,B32B15/08@J,C23C18/20@A,C23C18/52@B,C23C18/34,C23C18/40,C23C28/00@B,H05K1/03,630@H,H05K1/03,670,C08J7/00,306
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 27, 2023
Publication Date: Oct. 11, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
