Japan, Oct. 7 -- SEIKO EPSON CORP has got intellectual property rights for 'METHOD FOR MANUFACTURING MOLDED PRODUCT.' Other related details are as follows:
Application Number: JP,2022-146833
Category (FI): C08J5/00,C08L3/02,C08K3/22
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Sept. 15, 2022
Publication Date: March 28, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
