Japan, Oct. 21 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE.' Other related details are as follows:
Application Number: JP,2021-207328
Category (FI): H05K3/46@T,H05K3/46@B
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 21, 2021
Publication Date: July 3, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
