Japan Intellectual Property Rights: METHOD FOR PROCESSING WAFER

Japan, Aug. 26 -- DISCO CORP has got intellectual property rights for 'METHOD FOR PROCESSING WAFER.' Other related details are as follows:

Application Number: JP,2022-172137

Category (FI): H10P54/50,H10P52/00@Y,H10P10/00@A,B23K26/53,B24B7/04@A,B24B9/00,601@H,H01L21/02@C,H01L21/302,105@Z,H01L21/68@N,H01L21/304,631,H01L21/304,622@W,H01L21/304,621@B,H01L21/304,601@Z,H01L21/304,611@Z,H10P54/90,101@Z,H10P50/20,105@Z,H10P50/24,H10P52/00@A,H10P52/00@C,H10P52/00@T,H10P52/00@W,H10P54/20,101,H10P54/30,H10P54/92,H10P54/94,H10P72/70,H10P95/60@Z

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Oct. 27, 2022

Publication Date: May 14, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.