Japan Intellectual Property Rights: METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, SEMICONDUCTOR LAYER SUPPORT STRUCTURE, AND SEMICONDUCTOR SUBSTRATE

Japan, Oct. 7 -- OKI ELECTRIC IND CO LTD has got intellectual property rights for 'METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, SEMICONDUCTOR LAYER SUPPORT STRUCTURE, AND SEMICONDUCTOR SUBSTRATE.' Other related details are as follows:

Application Number: JP,2022-173115

Category (FI): H10P56/00@X,H01L21/02@C,H01L21/304,631,H01L21/02@B,H10P52/00@C,H10P10/00@Z,H10P56/00@Z

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Oct. 28, 2022

Publication Date: May 14, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.