Japan Intellectual Property Rights: METHOD OF PROCESSING WAFER

Japan, Oct. 15 -- DISCO CORP has got intellectual property rights for 'METHOD OF PROCESSING WAFER.' Other related details are as follows:

Application Number: JP,2022-140655

Category (FI): H01L21/304,631,H10P54/50,H10P54/20,201,H10P52/00@R,H10P52/00@C,B23K26/53,B24B7/04@A

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Sept. 5, 2022

Publication Date: March 15, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.