Japan, Sept. 16 -- INTERNATIONAL BUSINESS MASCHINES CORPORATION has got intellectual property rights for 'METHODS OF FORMING INTEGRATED CHIPS, AND INTEGRATED CHIPS (BACKSIDE POWER RAILS).' Other related details are as follows:
Application Number: JP,2022-153809
Category (FI): H10B43/27,H01L27/11582,H01L27/11556,H01L29/78,371,H01L21/88@B,H10W20/44@X,H10W20/41@B,H10W20/00@B,H10D30/69,H10D30/68,H10D30/01,501,H10B41/27,H01L21/90@A
Stage: PROBLEM TO BE SOLVED: To solve the problem in which forming buried power rails between cell spaces becomes challenging as devices are reduced in size and placed close to one another.SOLUTION: Integrated chips and methods of forming the same include forming a stack of layers, including a device stack above a first sacrificial layer, above a substrate. The first sacrificial layer is replaced with a first etch stop layer. The substrate is removed, exposing a substrate side of the stack of layers. The substrate side of the stack of layers is etched to form a trench, stopping on the first etch stop layer. A conductive line is formed in the trench.SELECTED DRAWING: Figure 16 (Grant)
Filing Date: Sept. 27, 2022
Publication Date: April 10, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
