Japan, Jan. 23 -- CONTI TEMIC MICROELECTRONIC GMBH has got intellectual property rights for 'MODULAR IMAGE INTERPOLATION METHOD.' Other related details are as follows:
Application Number: JP,2024-002421
Category (FI): B60R1/22,H04N7/18@J,H04N7/18@K
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 11, 2024
Publication Date: March 27, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
