Japan, Oct. 7 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'MOISTURE-CURABLE REACTIVE HOT-MELT ADHESIVE COMPOSITION HAVING LOW TENSILE MODULUS OF ELASTICITY AND BONDED BODY.' Other related details are as follows:
Application Number: JP,2022-173111
Category (FI): C09J11/06,C09J175/04
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Oct. 28, 2022
Publication Date: May 14, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
