Japan, Sept. 18 -- KYORAKU CO LTD has got intellectual property rights for 'PACKAGE FOR MICROWAVE OVEN.' Other related details are as follows:
Application Number: JP,2021-207540
Category (FI): B65D81/34@U
Stage: PROBLEM TO BE SOLVED: To provide a package for a microwave oven, which can suppress the inside of the package from being brought into a decompression state, after the package using a container made of paper materials is heated in the microwave oven.SOLUTION: The package for a microwave oven is provided with a film-shaped lid part and a container sealed with the lid. The container is constituted of paper raw material layers and laminated resin layers made to adhere to the paper raw material layers. The container has a container main body formed in a concave shape which can store contents, an annular flange part provided to extend outward from an upper end of the container main body, and a heat-welded part in which the flange part is heat-welded to the lid part. The heat-welded part is provided across a whole circumference of the flange part. The heat-welded part comprises a vapor discharge part for discharging vapor. With respect to a vapor discharge flange part which is a site at which the vapor discharge part is provided of the flange part, a warpage generation structure configured to generate warpage in the vapor discharge flange part, during heating.SELECTED DRAWING: Figure 1 (Grant)
Filing Date: Dec. 21, 2021
Publication Date: July 3, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
