Japan, March 3 -- ABLIC INC has got intellectual property rights for 'PACKAGE SUBSTRATE AND SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2023-036089
Category (FI): H01L23/12@N,H01L23/12@Q,H05K1/02@J,H05K3/46@B,H05K3/46@N,H05K3/46@Q,H10W70/62,H10W70/685
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 9, 2023
Publication Date: June 11, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
