Japan, Sept. 7 -- SAMSUNG SDI CO LTD has got intellectual property rights for 'PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME.' Other related details are as follows:
Application Number: JP,2024-186468
Category (FI): C08F290/06,C08G73/12,H01L21/312@D,G03F7/027,514,G03F7/027,502,H10P14/68@D
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Oct. 23, 2024
Publication Date: Jan. 15
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
