Japan, Feb. 24 -- FUJIMI INC has got intellectual property rights for 'POLISHING COMPOSITION AND POLISHING METHOD.' Other related details are as follows:
Application Number: JP,2022-014871
Category (FI): B24B37/00@H,H10P52/40,H10P52/00@H,H10P52/00@T,H10P52/20,C09K3/14,550@D,C09G1/02,H01L21/304,622@D,C09K3/14,550@Z,H01L21/304,622@X,H10P52/00@X
Stage: PROBLEM TO BE SOLVED: To provide a polishing composition capable of performing polishing such that the surface of an object to be polished after polishing has extremely high smoothness.SOLUTION: A polishing composition includes colloidal silica and hydrogen peroxide, and the colloidal silica has an average secondary particle diameter of less than 80 nm and a degree of association of 1.5 or more, and the pH of the polishing composition is 5 or more, and the colloidal silica in the polishing composition has a negative zeta potential.SELECTED DRAWING: None (Grant)
Filing Date: Feb. 2, 2022
Publication Date: Aug. 15, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
