Japan, July 20 -- JSP CORP has got intellectual property rights for 'POLYAMIDE-BASED RESIN FOAM PARTICLES AND POLYAMIDE-BASED RESIN FOAM PARTICLE MOLDING.' Other related details are as follows:
Application Number: JP,2023-020859
Category (FI): C08J9/16
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Feb. 14, 2023
Publication Date: Aug. 26, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
