Japan, March 25 -- DIC CORP has got intellectual property rights for 'POLYINDENE COMPOUND, CURABLE COMPOSITION, CURED PRODUCT, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR ENCAPSULANT, AND SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2022-054611
Category (FI): C07C2/86,B32B15/08@J,H05K1/03,610@H,H05K3/46@T,C07C22/04,C08F10/14,C07C17/266,C07C29/44,C07C33/36,C08J5/24,H01L23/30@R,H10W74/47,C07C13/465
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 29, 2022
Publication Date: Oct. 12, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
