Japan, Feb. 27 -- DAIKIN IND LTD has got intellectual property rights for 'POWER MODULE AND SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2024-027716
Category (FI): H01L25/04@C,H10W90/00,800,H10W40/60@M
Stage: PROBLEM TO BE SOLVED: To facilitate the dissipation of heat generated in a semiconductor element.SOLUTION: A first wiring member (11) has a mounting surface (15) on which a semiconductor element (2) is mounted, and an exposed surface (16) that is exposed on the side opposite to the mounting surface (15). A second wiring member (12) is disposed at a distance from the first wiring member (11) in a direction perpendicular to the thickness direction of the first wiring member (11). A holding member (20) is disposed between the first wiring member (11) and the second wiring member (12) and holds the first wiring member (11) and the second wiring member (12). The holding member (20) includes a protrusion (22). The protrusion (22) protrudes from the exposed surface (16) toward the exposed surface (16) in the thickness direction.SELECTED DRAWING: Figure 1 (Grant)
Filing Date: Feb. 27, 2024
Publication Date: Sept. 8, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
