Japan, Jan. 21 -- GENERAL ELECTRIC CO has got intellectual property rights for 'POWER OVERLAY STRUCTURE FOR MULTI-CHIP SEMICONDUCTOR PACKAGE.' Other related details are as follows:
Application Number: JP,2024-136985
Category (FI): H10W90/00,400@D,H01L23/52@D,H10W70/00,301@L,H10W70/62,500,H10W90/00,800,H01L25/04@C,H01L23/12,301@L,H01L23/12,501@P
Stage: Grant (IP right document published.)
Filing Date: Aug. 16, 2024
Publication Date: Feb. 28, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
