Japan, June 10 -- SHOWA DENKO MATERIALS CO LTD has got intellectual property rights for 'PREPREG, SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES, AND METHOD FOR PRODUCING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES.' Other related details are as follows:
Application Number: JP,2021-004831
Category (FI): C08J5/24,H10W70/695,H01L23/14@R
Stage: Grant (IP right document published.)
Filing Date: Jan. 15, 2021
Publication Date: July 28, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
