Japan, July 14 -- APPLIED MATERIALS INC has got intellectual property rights for 'PROCESSING CHAMBER WITH PLURALITY OF PLASMA UNITS.' Other related details are as follows:
Application Number: JP,2025-069336
Category (FI): H01L21/304,645@C,H10P50/20,101@G,H10P14/60,101@B,H01L21/302,101@G,H01L21/31@B,H10P70/00,105@C
Stage: PROBLEM TO BE SOLVED: To provide a processing apparatus that includes both a remote plasma unit and a direct plasma unit and a process.SOLUTION: In a processing tool 200, a processing chamber 201 that accommodates a semiconductor substrate 230 in a processing region 215 includes a remote plasma unit 206 and a direct plasma unit 208. One of the remote plasma unit and the direct plasma unit generates remote plasma and the other of the remote plasma unit and the direct plasma unit generates direct plasma. The combination of the remote plasma unit and the direct plasma unit is used to remove, etch, clean, or treat residue on a substrate from previous processing and/or from native oxide formation. The combination of the remote plasma unit and the direct plasma unit is used to deposit thin films on a substrate.SELECTED DRAWING: Figure 2 (Grant)
Filing Date: April 21, 2025
Publication Date: Aug. 5, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
