Japan Intellectual Property Rights: PROCESSING METHOD OF WAFER AND PROCESSING METHOD OF LAMINATED WAFER

Japan, Oct. 7 -- DISCO CORP has got intellectual property rights for 'PROCESSING METHOD OF WAFER AND PROCESSING METHOD OF LAMINATED WAFER.' Other related details are as follows:

Application Number: JP,2022-178565

Category (FI): H01L21/304,631,H10P95/60@Z,H10P52/00@R,H10P52/00@C,B24B19/02,B24B7/04@A,H01L21/304,601@Z

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Nov. 8, 2022

Publication Date: May 20, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.