Japan Intellectual Property Rights: PROCESSING METHOD OF WAFER

Japan, Sept. 30 -- DISCO CORP has got intellectual property rights for 'PROCESSING METHOD OF WAFER.' Other related details are as follows:

Application Number: JP,2023-012136

Category (FI): H10P54/20,201,H10P58/00@B,H10P52/00@W,H10P52/00@R,B23K26/53,H01L21/78@B,H01L21/304,622@W

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Jan. 30, 2023

Publication Date: Aug. 9, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.