Japan, Oct. 15 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'RELEASE FILM AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE.' Other related details are as follows:
Application Number: JP,2022-119101
Category (FI): H10W74/01@T,B32B27/00@L,H10W74/10@Z,B05D5/08,B32B27/30@A,H01L21/56@T,B32B3/30,C09J7/40,B05D5/08@Z,H01L23/28@Z
Stage: Grant (IP right granted following substantive examination.)
Filing Date: July 26, 2022
Publication Date: Feb. 7, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
