Japan, Sept. 30 -- RICOH CO LTD has got intellectual property rights for 'RESIN COMPOSITION, MOLDED BODY, ELECTRONIC COMPONENT, AND, ELECTRONIC EQUIPMENT.' Other related details are as follows:
Application Number: JP,2022-045392
Category (FI): C08K5/521,C08L25/06,C08L27/18,C08L55/02,C08L69/00
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 22, 2022
Publication Date: Oct. 4, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
