Japan, June 10 -- MITSUBISHI ENGINEERING PLASTICS CORP has got intellectual property rights for 'RESIN COMPOSITION, MOLDED PRODUCT, AND ELECTROMAGNETIC WAVE ABSORBER.' Other related details are as follows:
Application Number: JP,2020-219282
Category (FI): C08K3/016,C08K7/14,C08L101/00,C08K7/06,C08L67/02,C08K3/04
Stage: Grant (IP right document published.)
Filing Date: Dec. 28, 2020
Publication Date: July 8, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
