Japan, June 10 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'RESIN COMPOSITION, PREPREG, LAMINATED PLATE, RESIN FILM, MULTILAYER PRINTED WIRING BOARD, ANTENNA DEVICE, AND ANTENNA MODULE.' Other related details are as follows:
Application Number: JP,2021-117246
Category (FI): C08J5/24,H05K1/03,610@N,C08L79/08@Z,H05K1/03,610@R,H05K3/46@T,H01Q1/38,H01Q23/00,C08K3/013,C08L83/04,B32B15/08@J,B32B15/088,C08L101/00,C08K3/24
Stage: Grant (IP right document published.)
Filing Date: July 15, 2021
Publication Date: Jan. 26, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
