Japan, Oct. 15 -- MURATA MFG CO LTD has got intellectual property rights for 'RESIN MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE.' Other related details are as follows:
Application Number: JP,2024-038639
Category (FI): H05K3/28@C,H05K3/28@B
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 13, 2024
Publication Date: Sept. 29, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
