Japan, Sept. 16 -- YAMAHA ROBOTICS CO LTD has got intellectual property rights for 'RESIN SEALING APPARATUS.' Other related details are as follows:
Application Number: JP,2024-147768
Category (FI): B29C43/32,H01L21/56@T,B29C43/18,H10W74/01@T
Stage: PROBLEM TO BE SOLVED: To provide a resin sealing device capable of resin-sealing works of different shapes on the same line.SOLUTION: The resin sealing device 1 includes a first press device 3 capable of resin-sealing a first workpiece W1, a second press device 4 capable of resin-sealing a second workpiece W2 smaller than the first workpiece W1, a resin supplying device 2 capable of supplying a resin material to the first workpiece W1 and the second workpiece W2, and a conveyance unit 19 capable of moving between the resin supplying device 2 and the first press device 3 and the second press device 4; The conveyance unit 19 includes a first support portion 91 that supports the first workpiece W1 and a second support portion 92 that supports the second workpiece W2, the first support portion 91 is disposed on the second support portion 92, and a passage region 93 through which the second workpiece W2 passes is formed in the first support portion 91.SELECTED DRAWING: Figure 1 (Grant)
Filing Date: Aug. 29, 2024
Publication Date: March 12
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
