Japan, July 14 -- APIC YAMADA CORP has got intellectual property rights for 'RESIN SEALING DEVICE AND RESIN SEALING METHOD.' Other related details are as follows:
Application Number: JP,2023-070696
Category (FI): H10W74/01@R,B29C43/34,H01L21/56@R
Stage: PROBLEM TO BE SOLVED: To improve quality of a resin sealed molding.SOLUTION: A resin sealing device comprises: a resin sealing metal mold that includes a first metal mold and a second metal mold that is opposite to the first metal mold; a loader hand that conveys a resin material and a plate-like member; a resin guard that is attached to an attachment surface of the loader hand; a resin material supply part that supplies the resin material; and a plate-like member supply part that supplies the plate-like member. The loader hand includes an extrusion member that extrudes the resin member and the plate-like member that are provided in an inner side of the resin guard. The resin guard includes: a first guide part that regulates a first space where the resin material is provided; a second guide part that is a second guide part regulating a second space where the plate-like member is provided, positioned to the side that is outer from the first guide part in a plan view of the resin guard, and positioned so as to be separated from an attachment surface of the loader hand from the first guide part; and a stopper part that couples the first guide part and the second guide part, and is contacted to the plate-like member.SELECTED DRAWING: Figure 4 (Grant)
Filing Date: April 24, 2023
Publication Date: Nov. 6, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
