Japan, Nov. 17 -- APIC YAMADA CORP has got intellectual property rights for 'RESIN SEALING DEVICE.' Other related details are as follows:
Application Number: JP,2022-007549
Category (FI): H01L21/56@R,B29C43/34
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 21, 2022
Publication Date: Aug. 2, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
