Japan Intellectual Property Rights: RESIN SHEET, MANUFACTURING METHOD THEREFOR, COPPER-CLAD LAMINATE, AND CIRCUIT SUBSTRATE

Japan, March 5 -- DAIKIN IND LTD has got intellectual property rights for 'RESIN SHEET, MANUFACTURING METHOD THEREFOR, COPPER-CLAD LAMINATE, AND CIRCUIT SUBSTRATE.' Other related details are as follows:

Application Number: JP,2024-010745

Category (FI): C08J5/18,C08L27/12,C08K7/00,C08K7/14,C08K3/36,C08L27/18,B32B15/082@B,C08K3/34,C08K3/28,B32B15/08@J,H05K1/03,610@H,H05K1/03,630@H,H05K1/03,610@R

Stage: PROBLEM TO BE SOLVED: To provide a resin sheet including a fluororesin with excellent thermal expansion characteristics in the thickness direction.SOLUTION: This resin sheet includes a fluororesin and an anisotropic filler, and the anisotropic filler is uniaxially oriented in the film thickness direction and is randomly distributed in the surface direction.SELECTED DRAWING: Figure 2 (Grant)

Filing Date: Jan. 29, 2024

Publication Date: Aug. 14, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.