Japan, March 23 -- TOKYO OHKA KOGYO CO LTD has got intellectual property rights for 'RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, AND COMPOUND.' Other related details are as follows:

Application Number: JP,2022-011024

Category (FI): C07C69/54@B,C07C69/88,C07D307/00,C07D307/33,330,C07D311/22,C07D333/28,C07D333/62,C07D409/04,C08F220/10,G03F7/039,601,G03F7/20,501

Stage: Grant (IP right document published.)

Filing Date: Jan. 27, 2022

Publication Date: Aug. 8, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.