Japan Intellectual Property Rights: SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE

Japan, Oct. 15 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE.' Other related details are as follows:

Application Number: JP,2022-031203

Category (FI): C08G59/18,C08K5/10,C08K7/26,C08L63/00@C,C08K3/36

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 1, 2022

Publication Date: Sept. 13, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.