Japan Intellectual Property Rights: SEALING RESIN FOR USE IN COMPRESSION MOLDING, AND FORMING METHOD AND FORMING DEVICE THEREOF

Japan, Sept. 30 -- APIC YAMADA CORP has got intellectual property rights for 'SEALING RESIN FOR USE IN COMPRESSION MOLDING, AND FORMING METHOD AND FORMING DEVICE THEREOF.' Other related details are as follows:

Application Number: JP,2023-050312

Category (FI): H01L21/56@R,H10W74/01@R,H10W74/01@T

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 27, 2023

Publication Date: Oct. 9, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.