Japan, Oct. 30 -- DENSO CORP,TOYOTA MOTOR CORP,MIRISE TECHNOLOGIES CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME.' Other related details are as follows:
Application Number: JP,2022-096016
Category (FI): H10D30/66,102@F,H10D30/66,102@S,H10D30/66,201@A,H10D62/10,101@D,H10D30/66,101@J,H10D30/66,101@H,H10D30/01,301@G,H10D30/01,301@E,H10D62/10,101@V,H10D8/01@B,H10D8/50@D,H10D8/50@F,H01L29/06,301@D,H01L29/06,301@V,H10D12/01@G,H10D12/01@E,H01L29/78,652@H,H01L29/78,652@M,H01L29/78,652@T,H01L29/78,653@A,H01L29/78,655@A,H01L29/78,658@E,H10D12/00,201@A,H10D12/00,102@F,H10D12/00,102@E,H10D12/00,102@D,H10D12/00,101@T,H01L29/78,658@G,H01L29/91@B,H01L29/91@D,H01L29/91@F,H10D12/00,101@A,H10D12/00,101@H,H10D12/00,101@J,H10D30/66,101@T,H10D30/66,102@D,H10D30/66,102@E
Stage: Grant (IP right document published.)
Filing Date: June 14, 2022
Publication Date: June 22, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.