Japan, Sept. 18 -- ASAHI KASEI CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:
Application Number: JP,2022-164694
Category (FI): H10W74/15,H10W70/69,H01L23/30@D,H01L23/12,501@P,H10W70/62,500
Stage: PROBLEM TO BE SOLVED: To provide a semiconductor device capable of protecting a semiconductor chip and improving adhesion between a protective layer side and an insulating layer side in a rewiring layer.SOLUTION: A semiconductor device includes a semiconductor chip 2, a sealing material 3 in contact with the semiconductor chip 2, a rewiring layer 4 having an area larger than that of the semiconductor chip 2 in plan view, and a protective layer 8 for protecting the semiconductor chip 2. The protective layer 8 is arranged between the semiconductor chip 2 and an insulating layer 6 of the rewiring layer 4, and a difference between a Young's modulus of the protective layer 8 and the insulating layer 6 is 0.8 to 5.0 GPa.SELECTED DRAWING: Figure 1 (Grant)
Filing Date: Oct. 13, 2022
Publication Date: April 25, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
