Japan Intellectual Property Rights: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Japan, Jan. 16 -- TOSHIBA CORP,TOSHIBA ELECTRONIC DEVICES & STORAGE CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2022-047433

Category (FI): H01L21/90@M,H01L29/06,301@F,H01L29/06,301@G,H01L29/06,301@S,H01L29/06,301@V,H01L29/44@Y,H01L29/78,652@J,H01L29/78,652@P,H01L29/78,653@A,H01L29/78,655@A,H01L29/78,655@F,H01L29/91@B,H01L29/91@D,H10D12/00,101@A,H10D12/00,101@H,H10D12/00,103,H10D12/00,103@B,H10D12/00,201@A,H10D30/66,101@L,H10D30/66,201@A,H10D62/10,101@F,H10D62/10,101@G,H10D62/10,101@S,H10D62/10,101@V,H10D64/20@F,H10D64/23@B,H10D64/23@D,H10D64/23@M,H10D64/23@Z,H10D8/01@B,H10D8/50@D,H10W20/47

Stage: Grant (IP right document published.)

Filing Date: March 23, 2022

Publication Date: Oct. 5, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.