Japan, Sept. 16 -- SHOGEN KODEN KOFUN YUGENKOSHI has got intellectual property rights for 'SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTURING THE SAME.' Other related details are as follows:
Application Number: JP,2024-090468
Category (FI): H10H20/01@A,H01L33/62,H10H20/857,H10H29/03,H10H29/01,H10H29/02
Stage: PROBLEM TO BE SOLVED: To provide a semiconductor device arrangement structure.SOLUTION: This structure includes: a substrate; an adhesive structure; and a first semiconductor device. The substrate includes an upper front surface, and the adhesive structure is positioned on the upper front surface and includes a first concave region. The first semiconductor device contains a lower front surface facing towards an adhesive layer and a conductive bump positioned in the first concave region under the lower front surface. The conductive bump contains a first part and a second part. The lower front surface is not in contact with the adhesive structure. The first part is directly in contact with the first concave region, and the second part is not directly in contact with the first concave region.SELECTED DRAWING: Figure 11B (Grant)
Filing Date: June 4, 2024
Publication Date: Dec. 17, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
