Japan, Sept. 30 -- CHIPBOND TECHNOLOGY CORP has got intellectual property rights for 'SEMICONDUCTOR PACKAGING AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGING.' Other related details are as follows:
Application Number: JP,2025-001791
Category (FI): H10W40/00,100,H10W40/20@B,H01L23/30@R,H01L23/36@A,H10W74/47,H10W74/10@J
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 6, 2025
Publication Date: Aug. 1, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
